协议整理合集

1.IBIS （I/O Buffer Information Specification） Version 7.2 Ratified January 27, 2023

2.IPC-2152-2009

3.IPC 2512A-2000

4.IPC-2221C-EN TOC2023 Generic Standard on Printed Board Design

5.IPC-7711D-7721D_ EN 2023 TOC Rework, Modification and Repair of Electronic Assemblies

6.IPC-A-610J_EN 2024 TOC Acceptability of Electronic Assemblies

7.JESD209-2F LPDDR2

8.JESD209-4D - LPDDR4

9.JESD209-5B - LPDDR5

10.LVDS——15963-1996

11.LVDS标准TIA-EIA-644-A-2001

12.mipi_A-PHY_specification_v1-0-er02

13.MIPI_D-PHY_Spec_V1.2

14.mipi_D-PHY_specification_v1-2

15.mipi_D-PHY_specification_v2-1-er01

16.OA_Automotive_Ethernet_ECU_TestSpecification_Layer_1_100BASE-T1_v3.0

17.OA_Automotive_Ethernet_ECU_TestSpecification_Layer_2_v3.0

18.OA_Automotive_Ethernet_ECU_TestSpecification_Layer_3-7_v3.0

19.QMAT5502-2021乘用车电气和电子部件通用测试要求

20.ISO 16750-2 2010

21.ISO 16750-3-2023

22.ISO 16750-2-2023

23.mipi_C-PHY_specification_v2-1